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 APT50DL120HJ
ISOTOP(R)Fast Diode Full Bridge Power Module
VRRM = 1200V IF = 50A @ Tc = 80C
Application * * * * Switch mode power supplies rectifier Induction heating Welding equipment High speed rectifiers
Features * * * * * * * * Ultra fast recovery times Soft recovery characteristics High blocking voltage High current Low leakage current Very low stray inductance High level of integration ISOTOP(R) Package (SOT-227)
+
~ -
Benefits * * * * * * Outstanding performance at high frequency operation Low losses Low noise switching Direct mounting to heatsink (isolated package) Low junction to case thermal resistance RoHS Compliant
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Absolute maximum ratings
Symbol VR VRRM IF(AV) IFRM Parameter Maximum DC reverse Voltage Maximum Peak Repetitive Reverse Voltage Maximum Average Forward Current Duty cycle = 50% 8.3ms TC = 80C TJ = 45C Max ratings 1200 50 A 100 Unit V
November, 2009 1-3 APT50DL120HJ - Rev 0
Maximum repetitive forward current limited by TJmax
These Devices are sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed. See application note APT0502 on www.microsemi.com
www.microsemi.com
APT50DL120HJ
All ratings @ Tj = 25C unless otherwise specified Electrical Characteristics
Symbol Characteristic VF IRM Diode Forward Voltage Maximum Reverse Leakage Current Test Conditions IF = 50A VR = 1200V Tj = 25C Tj = 125C Tj = 25C Tj = 125C Min Typ 1.6 1.6 Max 2.1 250 500 Unit V A
Dynamic Characteristics
Symbol Characteristic trr Qrr Err Reverse Recovery Time Reverse Recovery Charge Reverse Recovery Energy IF = 50A VR = 600V
di/dt = 1900A/s
Test Conditions Tj = 25C Tj = 125C Tj = 25C Tj = 125C Tj = 25C Tj = 125C
Min
Typ 170 280 5.6 9.9 2.2 4.1
Max
Unit ns C mJ
Thermal and package characteristics
Symbol RthJC RthJA VISOL TJ,TSTG TL Torque Wt Characteristic Junction to Case Thermal resistance Junction to Ambient
RMS Isolation Voltage, any terminal to case t =1 min, I isol<1mA, 50/60Hz
Min
Typ
Max 0.72 20 150 300 1.5
Unit C/W V C N.m g
Storage Temperature Range Max Lead Temp for Soldering:0.063" from case for 10 sec Mounting torque (Mounting = 8-32 or 4mm Machine and terminals = 4mm Machine) Package Weight
2500 -55
29.2
SOT-227 (ISOTOP(R)) Package Outline
31.5 (1.240) 31.7 (1.248) 7.8 (.307) 8.2 (.322) W=4.1 (.161) W=4.3 (.169) H=4.8 (.187) H=4.9 (.193) (4 places) 11.8 (.463) 12.2 (.480) 8.9 (.350) 9.6 (.378) Hex Nut M4 (4 places)
r = 4.0 (.157) (2 places)
4.0 (.157) 4.2 (.165) (2 places)
0.75 (.030) 0.85 (.033)
25.2 (0.992) 25.4 (1.000) 3.30 (.130) 12.6 (.496) 4.57 (.180) 12.8 (.504)
3.3 (.129) 3.6 (.143) 14.9 (.587) 15.1 (.594) 30.1 (1.185) 30.3 (1.193) 38.0 (1.496) 38.2 (1.504)
1.95 (.077) 2.14 (.084)
Dimensions in Millimeters and (Inches)
www.microsemi.com
2-3
APT50DL120HJ - Rev 0
November, 2009
APT50DL120HJ
Typical Performance Curve
Forward Characteristic of diode 100 80 60 40 20 0 0 0.5 1 1.5 VF (V) 2 2.5
TJ=125C
Energy losses vs Collector Current 6 5 Err (mJ) 4 3 2 1
VCE = 600V VGE = -15V TJ = 125C
IF (A)
TJ=125C
TJ=25C
0 0 20 40 IF (A) 60 80 100
maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration 0.8 Thermal Impedance (C/W) 0.9 0.6 0.7 0.5 0.3 0.2 0.1 0.05 0 0.00001 0.0001 0.001 0.01 0.1 1 10 Single Pulse
0.4
rectangular Pulse Duration (Seconds)
ISOTOP(R) is a registered trademark of ST Microelectronics NV
Microsemi reserves the right to change, without notice, the specifications and information contained herein
Microsemi's products are covered by one or more of U.S patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522 5,262,336 6,503,786 5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,058 6,939,743 7,352,045 5,283,201 5,801,417 5,648,283 7,196,634 6,664,594 7,157,886 6,939,743 7,342,262 and foreign patents. U.S and Foreign patents pending. All Rights Reserved.
www.microsemi.com
3-3
APT50DL120HJ - Rev 0
November, 2009


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